BRAV-7220｜AI MEC Computing System
Intel® Tiger lake UP3 CPU, 3*LAN, 5*USB, 2*COM, 1*DIO, HDMI+DP, 2*M.2 support 4G LTE/5G NR，2*M.2 support edge AI module
BRAV-7220 is an AI MEC computing system with high energy efficiency ratio, powered by Intel® Tiger lake UP3 ULT SoC series CPU. 2.5G network port and 5G NR wireless network, support dual M.2 edge AI calculation module, no fan heat dissipation, DC 9-36V wide power input，can realize multilateral access, can be used as MEC edge computing for intelligent transportation and machine vision detection.
Key Features
- Intel® Tiger lake U Soc CPU
- Aluminum-magnesium alloy, fanless passive heat dissipation design
- Intel® I225V chip，3*2.5G LAN
- 1*DP+1*HDMI for 8K+4K dual display
- 2*M.2 B-Key support 4G LTE or 5G NR wireless routes
- 2*M.2 M-key is PCIe x2 signal, supports Hailo-8™ M.2 module
- 1*mSATA and 1*easy pluggable 2.5“ SATA dual storage disks
- 2*COM，2*USB3.2 + 3*USB2.0，1*DIO
- DC9~36V wide power input，with short circuit, over-voltage and over-current protection
- DC 12V/2A radar power supply output
| CPU | Intel® Tiger lake U Celeron/Core I3/I5/I7 CPU，ULT SoC，TDP 12W/15W/28W |
| Memory | 2*DDR4 SO-DIMM slot, support 3200MHz, up to 64GB |
Expansion | 1*M.2 3042 B-key, with SIM card slot, PCIe x1 + USB2.0 signal, support 4G LTE wireless function module |
| 1*M.2 3052 B-key, with SIM card slot, PCIe x1 + USB2.0 signal, support 4G LTE or 5G NR wireless function module | |
| 1*M.2 2280 M-Key , PCIe x2 Gen4.0 signal, support NVMe high-speed memory card or edge AI computing module | |
| 1*M.2 2280 M-Key , PCIe x2 Gen3.0 signal, support NVMe high-speed memory card or edge AI computing module | |
| Graphics | Intel UHD or Iris® Xe Graphics，supports Intel DL boost deep learning enhancement technology, DirectX 12.1，openGL 4.6 and OpenCL 2.0，HDMI 2.0 max res. 4096 x 2304@60Hz，DP 1.4 max res. 7680*4320@60Hz |
| Audio | （NON） |
| LAN | 3*Intel I225V chip, 10M/100M/1000M/2.5G adaptive, support iAMT 13.0，i5/i7 CPU supports vPro technology |
Storge | 1*2.5“ SATA Bay, easy plug design, supports the transmission speed of 6G bit/ s at most |
| 1*mSATA full height, SATA3 signal | |
| 2*M.2 Type 2280 M-Key, PCIe x2 signal supports NVMe ultra-high speed solid state storage | |
| DIO | 8bit DIO, TTL signal, 2.5KV optical isolation input and output |
I/O Interface | Front I/O: 3*2.5G LAN RJ45；2*USB3.2(Type A)；2*USB2.0 (Type A)；1*HDMI and 1*DP; 2*RS232/422/485 DB9 male; DC-IN 3pin Phoenix socket + DC 12V out 4pin Phoenix socket; 4*SAM antenna hole position |
Side I/O: 1*8bit DIO (2*5Pin Phoenix terminal)；2*SIM card slot; 1*MIPI CSI 60pin high-speed port (Opt.)；1*HDD；1*REMOTE SW | |
| Internal I/O: 1*USB2.0 (Type A)；1*SM Bus(4pin wafer) | |
| I-port Interface | Supports built-in 1*USB2.0 lead, or M.2 function module expansion ports such as dual network ports, Can bus, and serial ports |
| Watchdog Timer | Watchdog timeout programmable via software 1 to 255 second |
| OS Support | WIN10 / Win11 / Linux |
| Structure | Aluminum-magnesium alloy, SGCC frame |
| Color | Granite gray + Graphite black |
| Mounting | Desktop Mounting with shock-absorbing and anti-skid foot pad, optional Din-Rail installation |
| Dimension | (L*W*H)：Main box: 289.6*183*89.6mm；Including mounting bracket：326.4*183*96.6mm |
| Net weight | TBD |
| Operating | -20℃～70℃（Single CPU without VPU）, airflow；-20℃～60℃（CPU and two VPUs operation）, airflow |
| temperature | |
| Storage | -40°C~85°C |
| Temperature | |
| Storage Humidity | 10~90%@40°C, Non-condensing |
| Vibration | 5grms/5~500Hz/random/in working (SSD); 1grms/5~500Hz/random/in working (HDD) |
| Shock | 50g peak acceleration(11ms duration)(SSD); 20g peak acceleration(11ms duration)(HDD） |
| Certification /EMC | CE/A1:B32FCC Class A |
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