BRAV-7220|AI MEC Computing System

BRAV-7220|AI MEC Computing System

Intel® Tiger lake UP3 CPU, 3*LAN, 5*USB, 2*COM, 1*DIO, HDMI+DP, 2*M.2 support 4G LTE/5G NR,2*M.2 support edge AI module

BRAV-7220 is an AI MEC computing system with high energy efficiency ratio, powered by Intel® Tiger lake UP3 ULT SoC series CPU. 2.5G network port and 5G NR wireless network, support dual M.2 edge AI calculation module, no fan heat dissipation, DC 9-36V wide power input,can realize multilateral access, can be used as MEC edge computing for intelligent transportation and machine vision detection.

2 years warranty

Key Features

  • Intel® Tiger lake U Soc CPU
  • Aluminum-magnesium alloy, fanless passive heat dissipation design
  • Intel® I225V chip,3*2.5G LAN
  • 1*DP+1*HDMI for 8K+4K dual display
  • 2*M.2 B-Key support 4G LTE or 5G NR wireless routes
  • 2*M.2 M-key is PCIe x2 signal, supports Hailo-8™ M.2 module
  • 1*mSATA and 1*easy pluggable 2.5“ SATA dual storage disks
  • 2*COM,2*USB3.2 + 3*USB2.0,1*DIO
  • DC9~36V wide power input,with short circuit, over-voltage and over-current protection
  • DC 12V/2A radar power supply output

CPUIntel® Tiger lake U Celeron/Core I3/I5/I7 CPU,ULT SoC,TDP 12W/15W/28W
Memory2*DDR4 SO-DIMM slot, support 3200MHz, up to 64GB
1*M.2 3042 B-key, with SIM card slot, PCIe x1 + USB2.0 signal, support 4G LTE wireless function module
1*M.2 3052 B-key, with SIM card slot, PCIe x1 + USB2.0 signal, support 4G LTE or 5G NR wireless function module
1*M.2 2280 M-Key , PCIe x2 Gen4.0 signal, support NVMe high-speed memory card or edge AI computing module
1*M.2 2280 M-Key , PCIe x2 Gen3.0 signal, support NVMe high-speed memory card or edge AI computing module
Intel UHD or Iris® Xe Graphics,supports Intel DL boost deep learning enhancement technology, DirectX 12.1,openGL 4.6 and OpenCL 2.0,HDMI 2.0 max res. 4096 x 2304@60Hz,DP 1.4 max res. 7680*4320@60Hz
LAN3*Intel I225V chip, 10M/100M/1000M/2.5G adaptive, support iAMT 13.0,i5/i7 CPU supports vPro technology
1*2.5“ SATA Bay, easy plug design, supports the transmission speed of 6G bit/ s at most
1*mSATA full height, SATA3 signal
2*M.2 Type 2280 M-Key, PCIe x2 signal supports NVMe ultra-high speed solid state storage
DIO8bit DIO, TTL signal, 2.5KV optical isolation input and output
I/O Interface
Front I/O: 3*2.5G LAN RJ45;2*USB3.2(Type A);2*USB2.0 (Type A);1*HDMI and 1*DP; 2*RS232/422/485 DB9 male; DC-IN 3pin Phoenix socket + DC 12V out 4pin Phoenix socket; 4*SAM antenna hole position
Side I/O: 1*8bit DIO (2*5Pin Phoenix terminal);2*SIM card slot; 1*MIPI CSI 60pin high-speed port (Opt.);1*HDD;1*REMOTE SW
Internal I/O: 1*USB2.0 (Type A);1*SM Bus(4pin wafer)
I-port Interface
Supports built-in 1*USB2.0 lead, or M.2 function module expansion ports such as dual network ports, Can bus, and serial ports
Watchdog TimerWatchdog timeout programmable via software 1 to 255 second
OS SupportWIN10 / Win11 / Linux
StructureAluminum-magnesium alloy, SGCC frame
ColorGranite gray + Graphite black
MountingDesktop Mounting with shock-absorbing and anti-skid foot pad, optional Din-Rail installation
Dimension(L*W*H):Main box: 289.6*183*89.6mm;Including mounting bracket:326.4*183*96.6mm
Net weightTBD
-20℃~70℃(Single CPU without VPU), airflow;-20℃~60℃(CPU and two VPUs operation), airflow
Storage Humidity10~90%@40°C, Non-condensing
Vibration5grms/5~500Hz/random/in working (SSD); 1grms/5~500Hz/random/in working (HDD)
Shock50g peak acceleration(11ms duration)(SSD); 20g peak acceleration(11ms duration)(HDD)
CE/A1:B32FCC Class A